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T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E l e c t r i c D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y n or u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
DRAWN
S P E C I F I C AT I O N
SILICON DIODE
DWG.NO.
CHECKED
CHECKED
DAT E
` ` `
NAME
Spec. No. Device Name Type Name
APPROVED
YA981S6R
MS5D3300
Fuji Electric Device Technology Co.,Ltd.
MS5D3300
1/12
H04-004-07b
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Date Classification Ind.
Revised
Content
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
Applied date Drawn
Records
MS5D3300
Checked
2/12
Approved
H04-004-06b
1. SCOPE This specification provides the ratings and the test requirement for FUJI SILICON DIODE YA981S6R
2. OUT VIEW, MOLDING RESIN, CHARACTERISTICS Ordering code YA981S6R Package type TO-220 Out view Page 9/12 Molding resin UL:V-0 Characteristics Page 10/12 12/12
Bar code label is EIAJ C-3 specification. Indispensable description items are shown as below. (1) Type name (2) Production code (3) Quantity (4) Lot (Date code) (5) Company code
3.RATINGS
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
3.1 MAXIMUM RATINGS (at Ta=25 Item Repetitive peak reverse voltage Average output current Non-repetitive forward surge current Operating junction temperature Storage temperature
unless otherwise specified.) Symbol VRRM Io IFSM Tj Tstg -40 50Hz Square wave duty =1/2 Tc = 99 Sine wave, 10ms 1shot Conditions Ratings 600 8 40 150 150 Units V A A
3.2 ELECTRICAL CHARACTERISTICS (at Ta=25 Item Forward voltage Reverse current Reverse recovery time Thermal resistance Symbol VF IR trr Rth(j-c)
unless otherwise specified.) Conditions IF = 8 A VR = VRRM IF=0.1A,IR=0.2A,Irec=0.05A Junction to case Maximum 3.0 25 0.026 2.5 Units V A s /W
3.3 MECHANICAL CHARACTERISTICS Mounting torque Approximate mass Recommended torque 0.3 0.5 Nm g 2.0
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3300
3/12
H04-004-03a
4.TEST AND INSPECTION 4.1 STANDARD TEST CONDITION Standard test condition is Ta=25 Ta=5 35 48 85%R.H. 65%R.H. If judgment is no doubt, the test condition is possible to test in normal condition 4.2 STRUCTURE INSPECTION It inspect with eye and measure, Item 2 shall be satisfied. 4.3 FORWARD AND REVERSE CHARACTERISTICS It inspect on the standard condition, Item 3.2 shall be satisfied. 4.4 TEST
Test No. Test items Terminal strength (Tensile) Terminal strength (Bending) Mounting strength Testing methods and conditions Reference standard EIAJ ED4701
EIAJ ED4701/401 method 1 EIAJ ED4701/401 method 3 EIAJ ED4701/402 method 2 EIAJ ED4701/403 test code D EIAJ ED4701/404 test code D EIAJ ED4701/303 test code A Sampling number Acceptance number
1
Pull force : 10N Force maintaining duration :101s Load force : 5N Number of times : 2times(90deg./time) Screwing torque value:(M3) : 4010N cm Frequency : 100Hz to 2kHz 2 Acceleration : 100m/s Sweeping time : 4min./1 cycle 4times for each X, Y&Z directions. Peak amplitude : 15km/s2 Duration time : 0.5ms 3times for each X, Y&Z directions. Solder : Sn-37Pb Solder temp. : 235 5 Immersion time : 5 0.5s Apply to flux Solder : Sn-3Ag-0.5Cu Solder temp. : 245 5 Immersion time : 5 0.5s Apply to flux Solder temp. : 2605C Immersion time : 101s Number of times : 1time
5
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
2
5
3
5
Mechanical test
4
Vibration
5 (0 : 1) 5
5
Shock
Solder ability 1 6 Solder ability 2
5
5
EIAJ ED4701/302 test code A
7
Resistance to soldering heat
5
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3300
4/12
H04-004-03a
Test No. 1 2 3
Test items High temp. Storage Low temp. Storage Temperature humidity storage Temperature humidity bias Unsaturated pressurized vapor
Testing methods and conditions Temperature : stg max Test duration : 1000h Temperature : stg min Test duration : 1000h Temperature : 852C Relative humidity : 855% Test duration : 1000h Temperature : 852C Relative humidity : 855% Bias voltage : VRRMx 0.8 Test duration : 1000h Temperature : 1302C Relative humidity : 855% Vapor pressure : 230kPa Test duration : 48h High temp. side : Tstg max Room temp. : 5 35 Low temp. side : Tstg min Duration time : HT 30min,RT 5min LT 30min Number of cycles : 100 cycles Fluid : pure water(running water) High temp. side : 100+0/-5C Low temp. side : 0+5/-0C Duration time : HT 5min,LT 5min Number of cycles : 100 cycles Ta=255C Rated load Test duration : 1000h Tj=Tjmax 50 3min ON, 3min OFF Test duration : 10000cycles Temperature : Ta=100 C Bias voltage : VR=VRRM duty=1/2 Test duration : 1000h
Reference standard EIAJ ED4701
EIAJ ED4701/201 EIAJ ED4701/202 EIAJ ED4701/103 test code C EIAJ ED4701/103 test code C EIAJ ED4701/103 test code F
Sampling number
Acceptance number
22 22 22
4
22
5 Endurance test
22
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
6
Temperature cycle
EIAJ ED4701/105
22
(0 : 1)
7
Thermal shock Steady state operating life Intermittent operating life High temp. Reverse bias
EIAJ ED4701/307 test code A
22
8
22
EIAJ ED4701/106 EIAJ ED4701/101
9
22
10
22
Failure criteria
IR USL x 5 VF USL x 1.1
USL : Upper specification limit
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3300
5/12
H04-004-03a
5.CAUTIONS Although Fuji Electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing physical injury, fire, or other problem in case any of the products fail. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. The products described in this specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. Computers OA equipment Communications equipment (Terminal devices) Machine tools Personal equipment AV equipment Industrial robots etc. Measurement equipment Electrical home appliances
The products described in this specification are not designed or manufactured to be used in equipment or systems used under life-threatening situations. If you are considering using these products in the equipment listed below, first check the system construction and required reliability, and take adequate safety measures such as a backup system to prevent the equipment from malfunctioning.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Transportation equipment (automobiles, trains, ships, etc.) Backbone network equipment Gas alarms, leakage gas auto breakers Burglar alarms, fire alarms, emergency equipment Nuclear control equipment etc. Do not use the products in this specification for equipment requiring strict reliability such as (but not limited to): Aerospace equipment 6.WARNINGS The Diodes should be used in products within their absolute maximum rating (voltage, current, temperature, etc. ). The diodes may be destroyed if used beyond the rating. The equipment containing Diodes should have adequate fuses or circuit breakers to prevent the equipment from causing secondary destruction (ex. fire, explosion etc...). Use the Diodes within their reliability and lifetime under certain environments or conditions. The Diodes may fail before the target lifetime of your products if used under certain reliability conditions. You must design the Diodes to be operated within the specified maximum ratings (voltage, current, temperature, etc. ) to prevent possible failure or destruction of devices. Consider the possible temperature rise not only for the junction and case, but also for the outer leads. Do not directly touch the leads or package of the Diodes while power is supplied or during operation, to avoid electric shock and burns. The Diodes are made of incombustible material. However, if a Diode fails, it may emit smoke of flame. Also, operating the Diodes near any flammable place or material may cause the Diodes to emit smoke or flame in case the Diodes become even hotter during operation. Design the arrangement to prevent the spread of fire. The Diodes should not used in an environment in the presence of acid, organic matter, or corrosive gas. (hydrogen sulfide, sulfurous acid gas.) The Diodes should not used in an irradiated field since they are not radiation proof. Aeronautical equipment Traffic-signal control equipment Submarine repeater equipment Medical equipment
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3300
6/12
H04-004-03a
INSTALLATION Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Solder Method Duration temperature Flow 260 5 10 1sec Soldering iron 350 10 3.5 0.5sec The immersion depth of the lead should basically be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. When flow-soldering, be careful to avoid immersing the package in the solder bath. Refer to the following torque reference When mounting the device on a heat sink. Excess torque applied to the mounting screw causes damage to the device and weak torque will increase the thermal resistance, both of which conditions may destroy the device. Table 2:Recommended tightening torque
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Package style
Screw
Recommended tightening torque
TO-220 M3 0.3 0.5N m The heat sink should have a flatness within 30 m and roughness within 10 m. Also, keep the tightening torque within the limits of this specification. Improper handling may cause isolation breakdown leading to a critical accident. We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is important to evenly apply the compound and to eliminate any air voids. STORAGE The Diodes must be stored at a standard temperature of 5 to 35 and relative humidity of 45 to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. The Diodes should not be subjected to rapid changes in temperature to avoid condensation on the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is steady. The Diodes should not be stored on top of each other, since this may cause excessive external force on the case. The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may cause presoldered connections to go fail during later processing. The Diodes should be stored in antistatic containers or shipping bags.
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3300
7/12
H04-004-03a
7.APPENDIX This products does not contain PBBs (Polybrominated Biphenyl) or PBDEs (Polybrominated Diphenyl Ether ) , substances. This products does not contain Class-I ODS and Class-II ODS substances set force by `Clean Air Act of US' law. If you have any questions about any part of this specification, please contact Fuji Electric Device Technology or its sales agent before using the product Neither Fuji nor its agents shall be held liable for any injury caused by using the products not in accordance with the instructions. This specification does not confer any industrial property rights or other rights, nor constitute a license for such rights.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3300
8/12
H04-004-03a
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
Sn-Cu Sn-Cu dipping (Pb 1000ppm) (Pb 1000ppm)
MS5D3300
9/12
H04-004-03a
Forward Characteristic (typ.)
Reverse Characteristic (typ.)
Tj=150C
Tj=125C
10
Tj=100C IR Reverse Current (A)
IF Forward Current (A)
Tj=150C Tj=125C Tj=100C Tj=25C
1
Tj=25C
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
0.1 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
VF Forward Voltage (V)
VR Reverse Voltage (V)
Forward Power Dissipation (max.)
30
Reverse Power Dissipation (max.)
0.035
360
0.030
DC
360
25
I0
VR
0.025
20 Square wave =60 Square wave =120 15 Sine wave =180 Square wave =180
Reverse Power Dissipation
(W)
0.020
=180
0.015
10
PR
5 Per 1element 0 0 2 4 6 8
0.010
0.005
0.000 0 100 200 300 400 500 600 700
IF(AV) Average Forward Current
(A)
VR
Reverse Voltage
(V)
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D3300
10/12
H04-004-03a
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f F u ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
IFSM
Tc
1000
100 110 120 130 140 150 70 80 90
Peak Half - Wave Current
Case Temperature (C)
100
(A)
10
160
1
0 2 4 6 8
1
10
DC
IF(AV) Average Forward Current
:Conduction angle of forward current for each rectifier element
IF(AV):Forward current of center-tap full wave connection
Current Derating (IF(AV)-Tc) (max.)
Surge Capability (max.)
Number of Cycles at 50Hz
Square wave =60 Square wave =180 Sine wave =180 Square wave =120
(A)
10 12
100
DWG.NO.
10 1 1
Fuji Electric Device Technology Co.,Ltd.
Cj Junction Capacitance (pF)
100 10
1000
VR
MS5D3300
100
Reverse Voltage (V)
Junction Capacitance Characteristic (typ.)
11/12
1000
H04-004-03a
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f F u ji E le c t r ic D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Transient Thermal Impedance
10 10
0 1
(C/W)
10 10
2
-1
10
-3
10
-2
10
-1
t Time
Transient Thermal Impedance (max.)
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
(sec)
10
0
10
1
10
2
MS5D3300
12/12
H04-004-03a

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